Wafer Level Chip Scale Packaging Using Wafer Bonder
Language: en
Pages:

Wafer Level Chip Scale Packaging Using Wafer Bonder

Authors: Kailash Upadhyaya
Categories:
Type: BOOK - Published: 2005 - Publisher:

GET EBOOK

Wafer-Level Chip-Scale Packaging
Language: en
Pages: 336

Wafer-Level Chip-Scale Packaging

Authors: Shichun Qu
Categories: Technology & Engineering
Type: BOOK - Published: 2014-09-10 - Publisher: Springer

GET EBOOK

Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, rel
Advances in Embedded and Fan-Out Wafer Level Packaging Technologies
Language: en
Pages: 576

Advances in Embedded and Fan-Out Wafer Level Packaging Technologies

Authors: Beth Keser
Categories: Technology & Engineering
Type: BOOK - Published: 2019-02-12 - Publisher: John Wiley & Sons

GET EBOOK

Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and mate
Fan-Out Wafer-Level Packaging
Language: en
Pages: 319

Fan-Out Wafer-Level Packaging

Authors: John H. Lau
Categories: Technology & Engineering
Type: BOOK - Published: 2018-04-05 - Publisher: Springer

GET EBOOK

This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the cur
Semiconductor Wafer Bonding
Language: en
Pages: 310

Semiconductor Wafer Bonding

Authors: H. Baumgart
Categories: Technology & Engineering
Type: BOOK - Published: 2002 - Publisher: The Electrochemical Society

GET EBOOK