Physics Design - Reliability and Packaging

Physics Design - Reliability and Packaging
Author: Yung-Chang Lee
Publisher:
Total Pages: 735
Release: 2007
Genre:
ISBN:


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Physics Design - Reliability and Packaging
Language: en
Pages: 735
Authors: Yung-Chang Lee
Categories:
Type: BOOK - Published: 2007 - Publisher:

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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Language: en
Pages: 1471
Authors: Ephraim Suhir
Categories: Technology & Engineering
Type: BOOK - Published: 2007-05-26 - Publisher: Springer Science & Business Media

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This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-
Power Electronic Packaging
Language: en
Pages: 606
Authors: Yong Liu
Categories: Technology & Engineering
Type: BOOK - Published: 2012-02-15 - Publisher: Springer Science & Business Media

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Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic diffe
Influence of Temperature on Microelectronics and System Reliability
Language: en
Pages: 332
Authors: Pradeep Lall
Categories: Technology & Engineering
Type: BOOK - Published: 2020-07-09 - Publisher: CRC Press

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This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device archi
Electronic Packaging
Language: en
Pages: 0
Authors: John H. Lau
Categories: Electronic packaging
Type: BOOK - Published: 1998 - Publisher: McGraw-Hill Professional Publishing

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Here is the ultimate electronic packaging resource, in which luminaries from the four intertwined disciplines of packaging present a one-stop guide to the state