Modeling Design And Characterization Of Through Vias In Silicon And Glass Interposers
Download and Read Modeling Design And Characterization Of Through Vias In Silicon And Glass Interposers full books in PDF, ePUB, and Kindle. Read online free Modeling Design And Characterization Of Through Vias In Silicon And Glass Interposers ebook anywhere anytime directly on your device. We cannot guarantee that every ebooks is available!
Related Books
Language: en
Pages:
Pages:
Type: BOOK - Published: 2011 - Publisher:
Advancements in very large scale integration (VLSI) technology have led to unprecedented transistor and interconnect scaling. Further miniaturization by traditi
Language: en
Pages: 379
Pages: 379
Type: BOOK - Published: 2013-11-05 - Publisher: World Scientific
3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integr
Language: en
Pages:
Pages:
Type: BOOK - Published: 2013 - Publisher:
Emerging I/O density and bandwidth requirements are driving packages to low-CTE silicon, glass and organic substrates for higher wiring density and reliability
Language: en
Pages: 643
Pages: 643
Type: BOOK - Published: 2012 - Publisher: ASM International
Language: en
Pages: 379
Pages: 379
Type: BOOK - Published: 2013-11-05 - Publisher: World Scientific
3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integr