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Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic in
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly pro
This book provides an overview of the lastest developments in biobased materials and their applications in food packaging. Written by experts in their respectiv
