Advanced Interconnects And Contact Materials And Processes For Future Integrated Circuits Volume 514
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Advanced Interconnects and Contact Materials and Processes for Future Integrated Circuits: Volume 514
Author | : S. P. Murarka |
Publisher | : |
Total Pages | : 596 |
Release | : 1998-11-02 |
Genre | : Technology & Engineering |
ISBN | : |
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Comprising the proceedings of an MRS symposium held in April of 1998, contributions in this volume are divided into ten sections: interconnection frontiers; aluminum interconnects; cobalt and other silicides; titanium silicide; MOSFET, source, drain, and interconnect engineering; copper interconnects and barriers; a poster session on advanced interconnects and contacts; contacts to compound semiconductor devices; novel interconnect materials and schemes; and diffusion barriers. Annotation copyrighted by Book News, Inc., Portland, OR
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