Ultra-Thin Chip Embedding and Interconnect Technology for System-in-Foil Applications

Ultra-Thin Chip Embedding and Interconnect Technology for System-in-Foil Applications
Author: Mahadi-Ul Hassan
Publisher:
Total Pages:
Release: 2017
Genre:
ISBN: 9783844052763


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Ultra-Thin Chip Embedding and Interconnect Technology for System-in-Foil Applications
Language: en
Pages:
Authors: Mahadi-Ul Hassan
Categories:
Type: BOOK - Published: 2017 - Publisher:

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Ultra-thin Chip Technology and Applications
Language: en
Pages: 471
Authors: Joachim Burghartz
Categories: Technology & Engineering
Type: BOOK - Published: 2010-11-18 - Publisher: Springer Science & Business Media

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Ultra-thin chips are the "smart skin" of a conventional silicon chip. This book shows how very thin and flexible chips can be fabricated and used in many new ap
Ultra-Thin Sensors and Data Conversion Techniques for Hybrid System-in-Foil
Language: en
Pages: 153
Authors: Mourad Elsobky
Categories: Technology & Engineering
Type: BOOK - Published: 2022-03-18 - Publisher: Springer Nature

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This book reports on the design, fabrication and characterization of a set of flexible electronic components, including on-foil sensors, organic thin-film trans
Hybrid Systems-in-Foil
Language: en
Pages: 92
Authors: Mourad Elsobky
Categories: Technology & Engineering
Type: BOOK - Published: 2021-10-14 - Publisher: Cambridge University Press

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Hybrid Systems-in-Foil (HySiF) is a concept that extends the potential of conventional More-than-More Systems-in/on-Package (SiPs and SoPs) to the flexible elec
Ultra-Thin Chip Technology and Applications
Language: en
Pages: 492
Authors:
Categories:
Type: BOOK - Published: 2011-07-01 - Publisher:

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