System Design and Fabrication Using Monolithic 3D Integration of Heterogeneous Technologies

System Design and Fabrication Using Monolithic 3D Integration of Heterogeneous Technologies
Author: Fan Wu
Publisher:
Total Pages:
Release: 2021
Genre:
ISBN:


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System Design and Fabrication Using Monolithic 3D Integration of Heterogeneous Technologies
Language: en
Pages:
Authors: Fan Wu
Categories:
Type: BOOK - Published: 2021 - Publisher:

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System Design and Fabrication Using Monolithic 3d Integration of Heterogeneous Technologies
Language: en
Pages: 0
Authors: Tony Fan Wu
Categories: Heterogeneous computing
Type: BOOK - Published: 2021 - Publisher:

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3D Integration in VLSI Circuits
Language: en
Pages: 217
Authors: Katsuyuki Sakuma
Categories: Technology & Engineering
Type: BOOK - Published: 2018-04-17 - Publisher: CRC Press

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Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D int
Three Dimensional System Integration
Language: en
Pages: 251
Authors: Antonis Papanikolaou
Categories: Architecture
Type: BOOK - Published: 2010-12-07 - Publisher: Springer Science & Business Media

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Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as
Wafer Level 3-D ICs Process Technology
Language: en
Pages: 365
Authors: Chuan Seng Tan
Categories: Technology & Engineering
Type: BOOK - Published: 2009-06-29 - Publisher: Springer Science & Business Media

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This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-pa