Simulation of Dynamic Recrystallization in Solder Interconnections During Thermal Cycling

Simulation of Dynamic Recrystallization in Solder Interconnections During Thermal Cycling
Author: Jue Li Li
Publisher:
Total Pages:
Release: 2013
Genre: Science
ISBN:


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Simulation of Dynamic Recrystallization in Solder Interconnections During Thermal Cycling.


Simulation of Dynamic Recrystallization in Solder Interconnections During Thermal Cycling
Language: en
Pages:
Authors: Jue Li Li
Categories: Science
Type: BOOK - Published: 2013 - Publisher:

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Simulation of Dynamic Recrystallization in Solder Interconnections During Thermal Cycling.
Simulation of Dynamic Recrystallization in Solder Interconnections During Thermal Cycling
Language: en
Pages:
Authors: Li Laurila (Tomi)
Categories: Science
Type: BOOK - Published: 2013 - Publisher:

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Simulation of Dynamic Recrystallization in Solder Interconnections during Thermal Cycling.
Recent Developments in the Study of Recrystallization
Language: en
Pages: 236
Authors: Peter Wilson
Categories: Science
Type: BOOK - Published: 2013-02-06 - Publisher: BoD – Books on Demand

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Recrystallization is a phenomenon moderately well documented in the geological and metallurgical literature. This book provides a timely overview of the latest
Recrystallization
Language: en
Pages: 480
Authors: Krzysztof Sztwiertnia
Categories: Science
Type: BOOK - Published: 2012-03-07 - Publisher: BoD – Books on Demand

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Recrystallization shows selected results obtained during the last few years by scientists who work on recrystallization-related issues. These scientists offer t
Solder Materials
Language: en
Pages: 388
Authors: Kwang-lung Lin
Categories: Technology & Engineering
Type: BOOK - Published: 2018-07-13 - Publisher: World Scientific

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This book provides a comprehensive overview of important aspects of solder materials including solderability and soldering reaction, physical metallurgy, mechan