Silicon Carbide and Related Materials, Proceedings of the Fifth Conference, 1-3 November 1993, Washington DC, USA

Silicon Carbide and Related Materials, Proceedings of the Fifth Conference, 1-3 November 1993, Washington DC, USA
Author: Michael G. Spencer
Publisher: CRC Press
Total Pages: 768
Release: 1994-06-29
Genre: Art
ISBN:


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USA companies working in this area include Westinghouse. This material is being investigated primarily in the USA, Japan and Russia alongside that into wide-gap compounds which feature similar characteristics. Applications include high temperature ultra-violet lasers, photodiodes, photodetectors, blue LEDs, high power microwave applications in radar and transmitter devices Special sale to delegates 200 @ 35 Previous volumes in series published by Springer Leading workers in field include Pavlidis (MIT) and Choyke (Pittsburgh, Dept Phys) Feng author is also presenting paper Research in this area is expanding


Silicon Carbide and Related Materials, Proceedings of the Fifth Conference, 1-3 November 1993, Washington DC, USA
Language: en
Pages: 768
Authors: Michael G. Spencer
Categories: Art
Type: BOOK - Published: 1994-06-29 - Publisher: CRC Press

GET EBOOK

USA companies working in this area include Westinghouse. This material is being investigated primarily in the USA, Japan and Russia alongside that into wide-gap
Silicon Carbide and Related Materials, Proceedings of the Fifth Conference, 1-3 November 1993, Washington DC, USA
Language: en
Pages: 768
Authors: Michael G. Spencer
Categories: Art
Type: BOOK - Published: 1994-06-29 - Publisher: CRC Press

GET EBOOK

USA companies working in this area include Westinghouse. This material is being investigated primarily in the USA, Japan and Russia alongside that into wide-gap
Silicon Carbide and Related Materials
Language: en
Pages: 768
Authors:
Categories: Crystal growth
Type: BOOK - Published: 1993 - Publisher:

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Fundamental Aspects of Ultrathin Dielectrics on Si-based Devices
Language: en
Pages: 503
Authors: Eric Garfunkel
Categories: Technology & Engineering
Type: BOOK - Published: 2012-12-06 - Publisher: Springer Science & Business Media

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An extrapolation of ULSI scaling trends indicates that minimum feature sizes below 0.1 mu and gate thicknesses of Audience: Both expert scientists and engineers
Electrical & Electronics Abstracts
Language: en
Pages: 1576
Authors:
Categories: Electrical engineering
Type: BOOK - Published: 1995 - Publisher:

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