Packaging of Wide Bandgap Power Semiconductors using Simulation-based Design

Packaging of Wide Bandgap Power Semiconductors using Simulation-based Design
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Total Pages: 0
Release: 2023
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ISBN: 9788772104263


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Packaging of Wide Bandgap Power Semiconductors using Simulation-based Design
Language: da
Pages: 0
Authors:
Categories:
Type: BOOK - Published: 2023 - Publisher:

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Wide Bandgap Power Semiconductor Packaging
Language: en
Pages: 242
Authors: Katsuaki Suganuma
Categories: Technology & Engineering
Type: BOOK - Published: 2018-05-28 - Publisher: Woodhead Publishing

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Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integr
Design and Characterization of High-temperature Packaging for Wide-bandgap Semiconductor Devices
Language: en
Pages: 140
Authors: Brian J. Grummel
Categories:
Type: BOOK - Published: 2012 - Publisher:

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This was confirmed by electrical resistivity measurement, EDS, FIB, and SEM characterization. Thermal and mechanical characterization of TLP die-attached sample
Power Electronic Packaging
Language: en
Pages: 606
Authors: Yong Liu
Categories: Technology & Engineering
Type: BOOK - Published: 2012-02-15 - Publisher: Springer Science & Business Media

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Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic diffe
Wafer-Level Chip-Scale Packaging
Language: en
Pages: 336
Authors: Shichun Qu
Categories: Technology & Engineering
Type: BOOK - Published: 2014-09-10 - Publisher: Springer

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Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, rel