MEMS Packaging

MEMS Packaging
Author: Tai-Ran Hsu
Publisher: IET
Total Pages: 310
Release: 2004
Genre: Technology & Engineering
ISBN: 9780863413353


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This book covers the entire spectrum of assembly, packaging and testing of MEMs (microelectro-mechanical systems) and microsystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering.


MEMS Packaging
Language: en
Pages: 310
Authors: Tai-Ran Hsu
Categories: Technology & Engineering
Type: BOOK - Published: 2004 - Publisher: IET

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This book covers the entire spectrum of assembly, packaging and testing of MEMs (microelectro-mechanical systems) and microsystems, from essential enabling tech
Advanced MEMS Packaging
Language: en
Pages: 577
Authors: John H. Lau
Categories: Technology & Engineering
Type: BOOK - Published: 2009-10-22 - Publisher: McGraw Hill Professional

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A comprehensive guide to 3D MEMS packaging methods and solutions Written by experts in the field, Advanced MEMS Packaging serves as a valuable reference for tho
Mems Packaging
Language: en
Pages: 363
Authors: Yung-cheng Lee
Categories: Technology & Engineering
Type: BOOK - Published: 2018-01-03 - Publisher: World Scientific

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MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical ac
Nano-Bio- Electronic, Photonic and MEMS Packaging
Language: en
Pages: 761
Authors: C.P. Wong
Categories: Technology & Engineering
Type: BOOK - Published: 2009-12-23 - Publisher: Springer Science & Business Media

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Nanotechnologies are being applied to the biotechnology area, especially in the area of nano material synthesis. Until recently, there has been little research
Nano-Bio- Electronic, Photonic and MEMS Packaging
Language: en
Pages: 582
Authors: C. P.(Ching-Ping) Wong
Categories: Technology & Engineering
Type: BOOK - Published: 2021-03-17 - Publisher: Springer Nature

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This book shows how nanofabrication techniques and nanomaterials can be used to customize packaging for nano devices with applications to electronics, photonics