Interconnect Planning for Physical Design of 3D Integrated Circuits

Interconnect Planning for Physical Design of 3D Integrated Circuits
Author: Johann Knechtel
Publisher:
Total Pages: 138
Release: 2014
Genre: Three-dimensional integrated circuits
ISBN: 9783183455201


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Interconnect Planning for Physical Design of 3D Integrated Circuits
Language: en
Pages: 138
Authors: Johann Knechtel
Categories: Three-dimensional integrated circuits
Type: BOOK - Published: 2014 - Publisher:

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Physical Design for 3D Integrated Circuits
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Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3
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This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimension
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Type: BOOK - Published: 2019-05-06 - Publisher: John Wiley & Sons

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This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and mate
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Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in cir