Handbook Of Lead Free Solder Technology For Microelectronic Assemblies
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Handbook of Lead-Free Solder Technology for Microelectronic Assemblies
Author | : Karl J. Puttlitz |
Publisher | : CRC Press |
Total Pages | : 1044 |
Release | : 2004-02-27 |
Genre | : Technology & Engineering |
ISBN | : 082475249X |
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This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.
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