Advances In Chemical Mechanical Polishing
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Language: en
Pages: 650
Pages: 650
Type: BOOK - Published: 2021-09-10 - Publisher: Woodhead Publishing
Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, hi
Language: en
Pages: 330
Pages: 330
Type: BOOK - Published: 2011-12-06 - Publisher: William Andrew
CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing
Language: en
Pages: 444
Pages: 444
Type: BOOK - Published: 2004-01-26 - Publisher: Springer Science & Business Media
This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor te
Language: en
Pages: 337
Pages: 337
Type: BOOK - Published: 2008-09-26 - Publisher: John Wiley & Sons
Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its univ
Language: en
Pages:
Pages:
Type: BOOK - Published: 2004 - Publisher:
