Advanced Polyimide Materials

Advanced Polyimide Materials
Author: Shi-Yong Yang
Publisher: Elsevier
Total Pages: 499
Release: 2018-04-20
Genre: Technology & Engineering
ISBN: 0128126418


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Advanced Polyimide Materials: Synthesis, Characterization and Applications summarizes and reviews recent research and developments on several key PI materials. A wide array of PI materials are included, including high performance PI films for microelectronic fabrication and packaging, display and space applications, fiber-reinforced PI composites for structural applications in aerospace and aviation industries, and PI photoresists for integrated circuit packaging. The chemical features of PI are also described, including semi-alicyclic PIs, fluorinated PIs, phosphorous-containing PIs, silicon-containing PIs and other new varieties, providing a comprehensive overview on PI materials while also summarizing the latest research. The book serves as a valuable reference book for engineers and students working on polymer materials, microelectronics manufacturing and packaging in industries such as aerospace and aviation. - Reviews the latest research, development and future prospective of polyimides - Describes the progress made in the research on polyimide materials, including polyimide films, matrices for carbon fiber composites, coatings for microelectronics and display devices, forms and fibers - Presents a highly organized work that is composed of different sections that are easily compared


Advanced Polyimide Materials
Language: en
Pages: 499
Authors: Shi-Yong Yang
Categories: Technology & Engineering
Type: BOOK - Published: 2018-04-20 - Publisher: Elsevier

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Advanced Polyimide Materials: Synthesis, Characterization and Applications summarizes and reviews recent research and developments on several key PI materials.
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Fillers and Reinforcements for Advanced Nanocomposites reviews cutting-edge, state-of-the-art research on the effective use of nanoscaled fillers and reinforcem
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Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and mate