3D Integration for NoC-based SoC Architectures

3D Integration for NoC-based SoC Architectures
Author: Abbas Sheibanyrad
Publisher: Springer Science & Business Media
Total Pages: 280
Release: 2010-11-08
Genre: Technology & Engineering
ISBN: 1441976183


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This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.


3D Integration for NoC-based SoC Architectures
Language: en
Pages: 280
Authors: Abbas Sheibanyrad
Categories: Technology & Engineering
Type: BOOK - Published: 2010-11-08 - Publisher: Springer Science & Business Media

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This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural des
Design and Test Strategies for 2D/3D Integration for NoC-based Multicore Architectures
Language: en
Pages: 167
Authors: Kanchan Manna
Categories: Technology & Engineering
Type: BOOK - Published: 2019-12-20 - Publisher: Springer Nature

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This book covers various aspects of optimization in design and testing of Network-on-Chip (NoC) based multicore systems. It gives a complete account of the stat
3D Interconnect Architectures for Heterogeneous Technologies
Language: en
Pages: 403
Authors: Lennart Bamberg
Categories: Technology & Engineering
Type: BOOK - Published: 2022-06-27 - Publisher: Springer Nature

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This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the c
Handbook of 3D Integration, Volume 4
Language: en
Pages: 488
Authors: Paul D. Franzon
Categories: Technology & Engineering
Type: BOOK - Published: 2019-05-06 - Publisher: John Wiley & Sons

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This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and mate
Designing 2D and 3D Network-on-Chip Architectures
Language: en
Pages: 271
Authors: Konstantinos Tatas
Categories: Technology & Engineering
Type: BOOK - Published: 2013-10-08 - Publisher: Springer Science & Business Media

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This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technol